The Air-Cooling Era — The Past · Stable & Mature

Low-cost, highly reliable thermal solutions for devices under 300W

Applications: LED lighting, projectors, traditional power supplies, communication equipment

Skived Fin Heatsink

Stamped Fin Heatsink

Extrusion Heatsink

The Liquid Cooling Era — Present Day · Explosive Growth

Precision thermal control for 1000W-class AI chips and EV batteries

Dominant solution in current data center and EV markets; CAGR exceeds 20%

Liquid Cold Plate

Manifold

CDU

Two-Phase & Additive Manufacturing — Future-Facing Exploration

Breaking the 1500W+ thermal barrier; ushering in a new era of isothermal cooling

Transitioning from niche to mainstream (2026–2027)

Vapor Chamber (VC)

Two-phase immersion cooling

3D-printed cold plates