High-Density Server CPU Heatsink
Dissipate 300W+ TDP with strict constraints on weight, flatness, and mechanical pressure.
Utilized a progressive die on a 250-ton press to form complex copper fins. Integrated skiving technology and precision welding for heat pipe attachment. Our in-house tooling ensured perfect consistency across millions of units.
Flatness: <0.05mm, Burr-free fin edges.
Automotive IGBT Liquid-Cooled Plate
Create a leak-proof, high-strength cooling module for electric vehicle inverters.
Employed transfer stamping for deep-drawn channels. In-house CNC machining and laser welding guaranteed perfect sealing. Full pressure decay testing in our lab.
GPU Vapor Chamber Baseplate
Produce a large, ultra-flat baseplate with an internal vacuum cavity for superior heat spreading.
Fine-blanking technology for a perfectly flat and burr-free periphery. Precision stamping and brazing to create the sealed chamber.
Surface flatness: <0.1mm, Perfect seal for vacuum.
Channel dimensional tolerance: ±0.1mm, 100% pressure tested.